LUMA Application AREAS

Fine Wire for Cutting Technology

Precision Fine Wire Solutions for Advanced Cutting Applications

The smallest wires often determine the largest breakthroughs.

Wire cutting technology replaces conventional tools with fine wires to machine the hardest and most brittle materials. Therefore, cutting with fine wire has become an indispensable technique in industries where conventional tools reach their limits. Whether in Wire EDM (Electrical Discharge Machining) or in diamond and abrasive wire sawing, the ability to achieve micrometer precision depends on the performance of the wire itself. This is where fine wire for cutting technology becomes critical.

At Luma Wire Tech, we provide tungsten and molybdenum fine wires – cleaned, polished, or plated – as the technical foundation for OEM manufacturers who aim to develop the next generation of cutting wires. With expertise in advanced plating technologies such as nickel and gold, we enable tailored performance in collaboration with machine builders and process owners.

Meet our team. Lead technical expert at Luma Wire Tech developing advanced custom micro cable solutions for demanding applications in medical, aerospace, and defense industries.

Ulrik Palmqvist, Ph.D.

You are welcome to contact me when you need professional assistance

Wire EDM (Electrical Discharge Machining)

Fine wire for cutting technology, Wire EDM machining.

In fine wire for cutting technology, Wire EDM represents one of the most precise and proven methods for machining ultra-hard materials. In Electrical Discharge Machining (EDM), a fine conductive wire acts as the tool, generating controlled electrical discharges that gradually erode the workpiece. The choice of wire material and diameter directly determines the balance between speed, accuracy, and stability.

Common wire materials in use today

Brass wires

The industry standard for general-purpose EDM. Brass combines good conductivity with reliable cutting speed, making it the default choice for most machine tasks. It is especially suitable for applications where productivity is more important than ultra-fine precision. Sometimes a zinc coating is added when throughput and process stability must be maximized.

Molybdenum wires

With high tensile strength and excellent straightness, molybdenum wires are particularly effective in applications requiring long, continuous cuts and repeatable accuracy. Manufacturers often use Molybdenum wires when stability under high tension is essential, for example in complex geometries or fine-feature machining.

Tungsten wires

Known for their exceptional stiffness and highest melting point of all metals (3,422 °C), tungsten wires are the preferred choice in micro-EDM and finishing operations. They excel in ultra-fine cutting where the manufactures require diameters below 30 μm, and where narrow kerfs, sharp corners, and precise contours matter more than cutting speed.

Typical wire dimensions in the market

  • General EDM: ~100–300 μm wire diameter, with 250 μm as the standard.
  • High-precision / micro-EDM: ~20–100 μm, with tungsten wires enabling even finer gauges.

Advantages and limitations

  • Brass: fast, cost-efficient, but limited stiffness at diameters below one hundred μm.
  • Zinc-coated brass: higher speed and fewer breaks but adds cost.
  • Molybdenum: stronger than Brass and potentially re-usable
  • Tungsten: unrivaled stiffness and precision at ultra-fine diameters, but slower for bulk cutting.

Where Luma Wire Tech adds value

At Luma Wire Tech, we focus on tungsten and molybdenum fine wires engineered for demanding EDM applications:

  • Tungsten wires from 4–300 μm – enabling both general EDM and extreme micro-EDM applications.
  • Gold-plated tungsten and molybdenum – combining conductivity with corrosion resistance for more stable performance in critical processes.

By offering wires at the very limits of today’s EDM technology, we provide OEMs and process engineers with the foundation to push accuracy, stability, and surface quality further than conventional brass wires allow.

Diamond Wire Sawing: Precision slicing with abrasive particles

Diamond wire sawing is another key application area within fine wire for cutting technology, combining speed with exceptional edge quality. In diamond wire sawing (DWS), a fine core wire coated with diamond particles slices through hard and brittle materials such as silicon, sapphire, SiC (silicon carbide), and technical ceramics. The choice of core wire and its diameter directly determine kerf loss, surface quality, and process stability.

Common core wire materials

  • High-strength steel is the dominant choice for mass production of silicon wafers, thanks to its fatigue resistance, flexibility, and cost-efficiency.
  • Stainless and high-carbon steels are variants designed for improved fatigue resistance and corrosion behavior in demanding environments.
  • Tungsten is an alternative used in research and specialty cutting, where the manufacturing process requires a very thin diameters (≤100 μm) and extreme stiffness.

While high-strength steel dominates the market, tungsten cores are gaining interest in advanced R&D contexts, were stiffness and wire stability matter most. As studies on brazed diamond wires with tungsten cores suggest, the potential for enhanced cutting precision and grit stability is significant (ScienceDirect).

Typical wire dimensions in the market

  • Silicon wafering (PV and semiconductors): 60–80 μm cores, with leading-edge production pushing below 60 μm to reduce kerf loss.
  • Sapphire, SiC, and optics: 100–350 μm wires, for example 125 μm (with a ~100 μm core) and 250 μm for thicker slices.
  • Specialty R&D wires: down to ~100–120 μm overall.

Advantages and applications

  • High-strength steel: robust, fatigue-resistant, and cost-effective, ideal for high-volume wafer slicing.
  • Stainless/high-carbon steel: enhanced corrosion and fatigue resistance, suitable for harsher or high-demand environments.
  • Tungsten: very stiff and dimensionally stable at ultra-fine gauges, suited for premium wafering, optics, and R&D where ultra-thin kerfs and edge quality are critical. 

Where Luma Wire Tech adds value

We provide tungsten fine wires in diameters between 5–300 μm, enabling OEMs and machine builders to explore the next generation of diamond wire solutions. Our advanced plating technologies use nickel which enhances bonding between the core and diamond particles, ensuring consistent grit exposure, longer tool life, and superior cutting performance. We welcome close collaboration with OEM manufacturers to co-develop customized wire solutions.

Abrasive Wire Cutting: Expanding precision into new materials

Abrasive wire cutting further expands the potential of fine wire for cutting technology, using a core wire combined with abrasive grains (such as silicon carbide, SiC, or alumina, aluminum oxide) or slurry to separate materials. While traditionally applied in foam, plastics, and softer composites, the technique is increasingly explored for harder and layered materials where conventional tools struggle.

Common core wire materials

  • Steel wires are the mainstream solution for foam and soft polymer cutting.
  • Tungsten is an emerging option for fine abrasive wires aimed at advanced composites and precision applications.

Typical wire dimensions in the market

  • Foam cutting: ~1,300 μm (fine variants).
  • Emerging precision applications: potential <200 μm with tungsten cores for hybrid or high-accuracy abrasive processes.

Advantages and applications

  • Steel wires: durable, cost-efficient, suitable for large-scale foam and polymer cutting, but limited precision due to coarse diameters.
  • Tungsten: enables much finer diameters (<200 μm) with high stiffness, unlocking new opportunities in precision cutting of composites, ceramics, and multi-layer materials.

Where Luma Wire Tech adds value

We provide tungsten fine wires that can function as carriers for abrasives at ultra-thin dimensions, enabling OEMs to design cutting tools that move beyond traditional foam processing. By combining fine diameters with advanced surface treatments and plating, we help pave the way for abrasive wire cutting to enter entirely new fields of application. And we welcome collaboration with OEMs to co-develop the most effective solutions.

Meeting OEM requirements with reproducible quality

For OEM manufacturers, the foundation of any cutting-wire is consistency. Wire mechanics, geometry, and surface properties must remain stable from the first to the last meter of the spool. At Luma Wire Tech, we build quality assurance into every step of our production process:

  • Geometry control: diameter tolerances down to microns, with verified roundness, cast & helix (straightness and dimensional stability of the wire), and surface profile.
  • Mechanical reliability: tensile strength targets (UTS) and break-mode statistics monitored over full spool lengths to ensure reproducibility.
  • Plating assurance: documented thickness, adhesion, and porosity, verified with SEM, EDS, and LOM analysis.
  • Surface cleanliness: etched and polished wires, with oxidation control for long-term stability.
  • Full traceability: complete documentation provided with every lot.

Why partner with Luma Wire Tech?

Choosing Luma means gaining a development partner and not just a supplier of fine wire for cutting technology. We combine materials expertise with flexible production to support OEMs in creating the next generation of cutting wires and fine wires for cutting technology:

  • We specialize in ultra-thin wires: tungsten and molybdenum from 4–300 μm, with plated wires available up to ~200 μm.
  • We provide advanced plating: gold and nickel and optionally other coatings on ultra-thin wires, with adhesion and porosity tightly controlled and documented.
  • We ensure secure supply: European production with short lead times and high manufacturing standards.
  • We collaborate with OEMs: pilot lots, A/B testing, and fast iteration cycles with engineers to accelerate innovation.

At Luma Wire Tech, we do not just deliver fine wires. We deliver a platform for OEMs to build cutting performance on, backed by traceable quality and a willingness to co-develop solutions for the future of wire-based machines.

Partnering for performance

At Luma Wire Tech, we recognize that the most significant advances in cutting technology happen when material expertise meets machine innovation.

Therefore, we are open and eager to establish partnerships with OEM manufacturers. By combining our knowledge in tungsten and molybdenum fine wires with the process insights of equipment builders and engineers, we can co-create wires that address the toughest cutting challenges.

From ultra-thin semiconductor wafer slicing to the precision machining of aerospace alloys, our fine wires are ready to become the backbone of tomorrow’s reliable and efficient processes, The leading source of fine wires for cutting technology. 

Shaping the future of cutting

The next generation of materials – harder, thinner, and more complex – demands a new generation of wires. At Luma Wire Tech, our expertise in metallurgy, advanced plating, and fine-wire manufacturing positions us to be the technical foundation for those developments.

We are looking to partner with OEMs who want to redefine what is possible in EDM, diamond wire sawing, and abrasive cutting. Together, we can push the boundaries of cutting technology, reduce kerf losses, and enable precision that was once out of reach.

How can we help you choosing the right wires for your application?