TECHNICAL DATA

Technical Product Information

Materials Overview

Base materialDiameter range [µm]PurityUTS [N/mm2]Rp 0,01 [N/mm2]Elongation [%]Surface treatment
Tungsten doped with K (W/K)4 – 200Min 99,95%W
60-65 ppm K		2600 – 35001000 – 20001,5 – 3Electroetching
Electropolishing
Electroplating
Tungsten W (Re-3%)4 – 200Min 97% W
3% Re		2700 – 39001000 – 20001 – 2,5 Electroetching
Electropolishing
Electroplating
Molybdenum ILQ doped with 0,03 % La2O310 – 200

Min 99,9% Mo 0,03%  La2O3

2100 – 2400700 – 14001 – 2Electroetching
Electroplating
ILQ Mo – after hydrogen annealing straightening10 – 200Min 99,9% Mo 0,03% La2O31700 – 2000600 – 12001 – 2Electroetching
Electroplating
Pure Mo – annealed10 – 200Min 99,97% Mo700 – 900600 – 900≥ 10%Electroetching
Electroplating

Tungsten doped with potassium (W/K 60ppm)

  • High density – absorbs radiation effectively (radiation shielding – (X-rays, gamma rays, particle accelerators)
  • Tungsten offers high tensile strength, hardness and high wear resistance even at low dimensions  (cutting tools & wear-resistant coatings)
  • Moderate conductivity
  • Good stability and creep resistance
  • The highest melting point of all metals (extreme heat applications)
  • High resistance to oxidation and corrosion

Molybdenum (Mo) ILQ doped with 0,03 % La2O3

  • Excellentfor high-temperature use High melting point (lower than W but still heat-resistant)
  • Molybdenum offers high tensile strength, hardness, and wearresistance while maintaining a lower density than W (aerospace and lightweight high-temperature applications)
  • Moderate corrosion resistance Good conductivity (Semiconductors & electronics)
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Material Properties

Material Properties of W/K – 60ppm compared to W/Re

PropertyW/K – 60ppm
Thermal conductivity+
Tensile strength and hardness≈
High-temperature stability / Creep resistance≈
Recrystallization temperature≈
Workability/formability≈
Corrosion resistance≈
Wear resistance+
Ductility–
Electron work function–
Electrical resistance–
≈ comparable, + higher, – lower than W/Re.  

W/Re

  • Electron work function is higher than W/K – 60ppm
  • Electrical resistance is higher than W/K – 60ppm
  • Ductility is higher than W/K – 60ppm
  • Lower thermal conductivity than W/K – 60ppm
  • Application: Material for electron scattering, nuclear reaction studies, neutron diffraction

Material Properties doped Molybdenum (ILQ 0.03% La2O3 Mo) compared to Pure Mo.

Hidden button -DONT DELETE
Property ILQ Mo
Thermal and electrical conductivity≈
Tensile strength+
Stability at RT≈
High-temperature stability / Creep resistance+
Recrystallization temperature+
Ductility after High-temperature use+
Elongation 
Elongation compared to annealed Pure Mo		≈ 
–
Weldability +

≈ comparable, + higher, – lower than pure Mo.

Application areas

General examples of Application areas of the wires

  • Antenna-mesh for Space Satellite systems
  • Particle accelerators: Detector Technology
  • Electronics: Semiconductors and Integrated circuit Testing; Connectors; Wire bonding;
  • Power Electronics /Batteries (Pseudocapacitors /Super condensators)
  • Medical: Guide Wires – radiopaque visibility; Medical wires for components used for brain stimulation and neuronal studies; Surgical robots; Stents; Catchers and Baskets
  • Military and Defense (Detectors, Sensors, Satellite systems
  • Musical Strings
  • Catalysis: Catalyst in petroleum refining and hydrogenation
  • Critical infrastructure security: Detector Technology
  • Technical textiles including Smart Textiles
  • Wire bonding technology
  • Energy: sensors and high temperature applications
  • Cutting technology tools
  • Specialty lighting (furnace components and lamp components)
  • R&D and Scientific high-precision instrumentation
  • Digital printing and 3D printing
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Gold and Nickel Coatings / Surface finishing

Coatings /Surface finishing

  • Electroplating: Reel to reel
  • Coatings: Gold, Nickel in Cyanide matrix as a strike or final plating.
  • Coating thickness: Customizing according to customer demands
  • Surfaces: polished (smooth), semi-polished and etched (less smooth).
  • Different coating formulations: adhesion and porosity might be adjusted with different formulation. (The higher the coating thicknesses the better coverage and less pores.)
Technical Product Information
Polished surface
Technical Product Information

Etched surface

Gold

Characteristics

  • Excellent corrosion resistance
  • Does not tarnish or oxidize
  • Easily shaped
  • Best malleability and ductility
  • Highly conductive
  • Biocompatible
  • Compact, soft, shiny and most chemically inert known metal

Pure gold soft
According to MIL standard (2007): Type III (min 99.9 % purity); Grade A (max 90 Knoop).

Gold – increased hardness
According to MIL standard (2007): Type III (min 99.9 % purity); Grade B (max 91-129 Knoop).

MaterialDimension < 50 µmDimension > 50 µm
W/K & W-Re wireCoating thickness corresponds to 3 – 5% by weight as standard0.5 µm an standard
Mo wireCoating thickness corresponds to 3 – 5% by weight as standard0.5 µm an standard

Nickel

Characteristics

  • Strike – act as a primer/pre-plating of a thin layer to add to a base material to achieve good adhesion between polished tungsten and gold.

Quality Material Analysis/Lab Testing

  • Unique procedural competences
  • Microscopy: surface appearances: determine microstructure, surface defects, morphology and elemental composition
    • Scanning Electron Microscope (SEM)
    • Energy-Dispersive X-ray Spectroscopy (EDS)
    • Light Optical Microscopy (LOM)
  • Atomic Absorption Spectroscopy (AAS) – spectro- analytical procedure for the quantitative measurement of chemical elements.
  • 3D VIEW software: surface roughness values
  • Adhesion metrologies
  • Climate chamber/Furnace – determine behavior and porosity
  • TS testing tool:: ductility, brittleness, elongation, UTS, proportionality limit
  • Straightness measurement

R&D Research and development

  • Materials and Electrochemical Research.
  • Participation in customer process development projects.
  • Tailor-made process forthe customer
  • Participation in international projects and national founded projects.
  • Collaboration with Universities and Research Institutes.
  • Literature research & Co-authors of scientific articles.
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W / K

FormulationExamples of Application areasPros/Cons
W – Etched – Pure gold softPrinters, Antennas, Instruments, Medical, Particle accelerators Good adhesion
W – Polished – Pure gold softParticle accelerators, Research, DetectorsLimited adhesion
W – Etched – Gold increased hardness

Antennas, Research, Medical, Particle accelerators, Electronics, Scientific engineering

Good adhesion
Increased wear resistance
W – Polished – Nickel – Gold increased hardnessMedical ResearchImproved adhesion, increased wear resistance
W – Semipolished – Nickel – Gold increased hardnessMedicalImproved adhesion, increased wear resistance
W – Etched – Nickel – Gold increased hardnessAntennasImproved adhesion, increased wear resistance

W / Re

FormulationExamples of Application areasPros/Cons
W / Re – Etched – Pure gold softInstitute, Particle accelerators, Nuclear Research, Detector Technology Good adhesion
W / Re – Polished – Pure gold softParticle accelerators Limited adhesion
W / Re – Etched – Gold increased hardnessDetectorsGood adhesion
Increased wear resistance
W / Re – Polished – Nickel – Gold increased hardnessResearch, Printing, Antennas, DetectorsImproved adhesion
Increased wear resistance
W – Etched – Nickel – Gold increased hardness Improved adhesion
Increased wear resistance

Mo

FormulationExamples of Application areasPros/Cons
Mo – Etched – Pure gold softAntennas, Research, MicrochipsGood adhesion
Mo – Etched – Gold increased hardnessAntennas, Research, Medical, E-textilesIncreased wear resistance
Mo – Etched – Nickel – Gold increased hardnessAntennasGood adhesion
Increased wear resistance

Contact us

Luma Wire Tech AB
VAT No: SE556466410901
Swedish Registration No: 556466-4109
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Amerikavaegen 5
SE-393 56 Kalmar
SWEDEN

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