Luma Wire Tech manufactures ultra-fine wires between 4 and 300 microns in diameter. Here you will find the provided comprehensive technical information about theese wires primarily manufactured using Tungsten and Molybdenum as base materials. Depending on application requirements, the wires are available either cleaned or plated and are delivered on spools containing a flexible wire length, from a few hundred to several thousand meters per spool.
For plated wires, the standard plating materials include gold and nickel. Additional technical options include alternative base materials such as Tungsten-Rhenium (97/3), Silver, Copper, and various copper alloys. On request, plating options can also include Silver, Palladium, and Platinum.
This technical information ensures our customers receive the exact wire specifications needed for demanding industries like medical technology, electronics, and aerospace.
This silvery metal has the sixth highest melting point among all metals, at 2,623°C. Its resistance to heat without expansion or softening makes it ideal for high-pressure, high-temperature applications.
Molybdenum wire is sometimes preferred over tungsten due to its lower density—about half that of tungsten—while still offering a high strength-to-weight ratio. Its light weight and high ductility make it the top choice for mesh wire in satellite antennas. This application specifically requires gold-plated molybdenum wire.
Gold-plated molybdenum is also used in electronics. Besides corrosion resistance, the gold layer improves electrical contact and solder wettability. Common uses include connectors and electronic tubes.
Tungsten has the highest melting point of all metals at 3,422°C, making it ideal for demanding applications like light bulb filaments, rocket nozzles, and electrodes. Its high density (19.25 g/cm³) allows for excellent absorption of radiation and X-rays, which is why it’s often used in medical guide wires for X-ray visibility.
With the lowest vapor pressure and thermal expansion of any pure metal, tungsten excels in power electronics and extreme environments such as jet propulsion. Above 1,650°C, it also has the highest tensile strength of any metal.
Gold plating on tungsten wire improves oxidation resistance and solderability. This makes it suitable for nuclear detectors, digital printing, medical devices, and technical textiles—any field requiring high stability and heat resistance.
Do you want to discuss technical features with our Technology Team?
| Base material | Diameter range** [µm] | Purity | UTS [N/mm2] | Rp 0,01* [N/mm2] | Elongation [%] | Surface treatment |
|---|---|---|---|---|---|---|
| Tungsten doped with K (W/K) | 4 – 300 | Min 99,95%W 60-65 ppm K | 2600 – 3500 | 1000 – 2000 | 1,5 – 3 | Electroetching Electropolishing Electroplating |
| Tungsten W (Re-3%) Available Soon | 4 – 300 | Min 97% W 3% Re | 2700 – 3900 | 1000 – 2000 | 1 – 2,5 | Electroetching Electropolishing Electroplating |
| Molybdenum ILQ doped with 0,03 % La2O3 | 10 – 300 | Min 99,9% Mo 0,03% La2O3 | 2100 – 2400 | 700 – 1400 | 1 – 2 | Electroetching Electroplating |
| ILQ Mo – after hydrogen annealing straightening | 10 – 300 | Min 99,9% Mo 0,03% La2O3 | 1700 – 2000 | 600 – 1200 | 1 – 2 | Electroetching Electroplating |
| Pure Mo – annealed | 10 – 300 | Min 99,97% Mo | 700 – 900 | 600 – 900 | ≥ 10% | Electroetching Electroplating |
*) Elongation automatically calculated by the software of the Tensile Strength machine.
**) Maximum plating diameter is approx. 200 μm.
| Abbreviation | Explanation |
|---|---|
| AAS | Atomic Absorption Spectroscopy |
| Au | Gold |
| E | Etched |
| EDS | Energy-Dispersive X-ray Spectroscopy |
| K | Potassium |
| La2O3 | Lanthanum (III) oxide |
| LOM | Light Optical Microscopy |
| Mo | Molybdenum |
| Mo-ILQ | Microdoped molybdenum alloy with a lanthanum oxide |
| N/mm2 | Newton per Square Millimeter |
| Ni | Nickel |
| P | Polished |
| ppm | parts per million |
| R&D | Research and Development |
| Re | Rhenium |
| Rp0,01 | Point of plastical change (non-reversible) in wire structure under stress |
| RT | Room Temperature |
| SEM | Scanning Electron Microscope |
| UTS | Ultimate Tensile strength |
| W | Tungsten |
| W/K | Tungsten doped with Potassium |
| W/Re | Tungsten alloyed with Rhenium |
| µm | micrometers |
| Property | W/K – 60ppm |
|---|---|
| Thermal conductivity | + |
| Tensile strength and hardness | ≈ |
| High-temperature stability / Creep resistance | ≈ |
| Recrystallization temperature | ≈ |
| Workability/formability | ≈ |
| Corrosion resistance | ≈ |
| Wear resistance | + |
| Ductility | – |
| Electron work function | – |
| Electrical resistance | – |
| Property | ILQ Mo |
|---|---|
| Thermal and electrical conductivity | ≈ |
| Tensile strength | + |
| Stability at RT | ≈ |
| High-temperature stability / Creep resistance | + |
| Recrystallization temperature | + |
| Ductility after High-temperature use | + |
| Elongation Elongation compared to annealed Pure Mo | ≈ – |
| Weldability | + |
≈ comparable, + higher, – lower than pure Mo.
Etched surface
Pure gold soft
According to MIL standard (2007): Type III (min 99.9 % purity); Grade A (max 90 Knoop).
Gold – increased hardness
According to MIL standard (2007): Type III (min 99.9 % purity); Grade B (max 91-129 Knoop).
| Material | Dimension < 50 µm | Dimension > 50 µm |
|---|---|---|
| W/K & W-Re wire | Coating thickness corresponds to 3 – 5% by weight as standard | 0.5 µm an standard |
| Mo wire | Coating thickness corresponds to 3 – 5% by weight as standard | 0.5 µm an standard |
Please contact us if you have questions regarding our plating features and technology processes!
| Formulation | Examples of Application areas | Pros/Cons |
|---|---|---|
| W – Etched – Pure gold soft | Printers, Antennas, Instruments, Medical, Particle accelerators | Good adhesion |
| W – Polished – Pure gold soft | Particle accelerators, Research, Detectors | Limited adhesion. Can be used in the application where there is no mechanical impact on the wire |
| W – Etched – Gold increased hardness | Antennas, Research, Medical, Particle accelerators, Electronics, Scientific engineering | Good adhesion, Increased wear resistance |
| W – Polished – Nickel – Gold increased hardness | Medical Research, Medical | Improved adhesion, Increased wear resistance |
| Formulation | Examples of Application areas | Pros/Cons |
|---|---|---|
| W / Re – Etched – Pure gold soft | Research institute, Particle accelerators, Nuclear Research, Detector Technology | Good adhesion |
| W / Re – Polished – Pure gold soft | Particle accelerators | Limited adhesion |
| W / Re – Polished – Nickel –Gold increased hardness | Research, Printing, Antennas, Detectors | Improved adhesion, Increased wear resistance |
| W – Etched – Gold increased hardness | Detectors | Good adhesion, Increased wear resistance |
| Formulation | Examples of Application areas | Pros/Cons |
|---|---|---|
| Mo – Etched – Pure gold soft | Antennas, Research, Microchips | Good adhesion |
| Mo – Etched – Gold increased hardness | Antennas, Research, Medical, E-textiles | Good adhesion, Increased wear resistance |
| Mo – Etched – Nickel – Gold increased hardness | Antennas | Good adhesion, Increased wear resistance |
Luma Wire Tech AB
VAT No: SE556466410901
Swedish Registration No: 556466-4109
DUNS No. (International registration No.): 357311950
07:30 – 16:00 (GMT + 1)
01:30 AM – 10:00 AM EST
Luma Wire Tech AB
Amerikavaegen 5
SE-393 56 Kalmar
SWEDEN
Copyright © Luma Wire Tech 2018
Powered by: Aditor.se